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"재료압출"

Article
Multi-Material Additive Manufacturing Process for 3-Dimensional Circuit Device Fabrication
Sung Taek Oh, In Hwan Lee, Ho-Chan Kim, Hae-Yong Cho
J. Korean Soc. Precis. Eng. 2018;35(3):349-354.
Published online March 1, 2018
DOI: https://doi.org/10.7736/KSPE.2018.35.3.349
Recently, various attempts have been made to apply the additive manufacturing technology directly to fabricate a product. In this regards, the industry is focusing on the multi-material additive manufacturing technology that can processes multiple materials simultaneously. This study is about the fabrication of a 3-dimensional circuit device (3DCD), based on the multimaterial additive manufacturing technology, which is combination of the material extrusion and the direct writing processes. The multi-material additive manufacturing system was developed based on the commercial multi-head FDM system. In addition, a contact type nozzle for the dispensing of the conductive material in the direct writing process is proposed. The 3-dimensional circuit device in which circuit elements are arranged on several layers was fabricated successfully, based on the presented multi-material additive manufacturing system.

Citations

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  • Application of Image Recognition Technology in Nozzle Cleaning for Material Extrusion Additive Manufacturing Processes
    Ho-Chan Kim, Yong-Hwan Bae, Hae-Yong Yun, In-Hwan Lee
    Journal of the Korean Society of Manufacturing Process Engineers.2024; 23(11): 20.     CrossRef
  • Optimization Design of Student KSAE BAJA Knuckle Using SLM 3D Printer
    Young Woo Im, Geon Taek Kim, Hyeon Sang Shin, Kang Min Kim, Bu Hyun Shin, Jong Won Lee, Jinsung Rho
    Journal of the Korean Society for Precision Engineering.2023; 40(9): 719.     CrossRef
  • Study on the Reduction of Food Fabrication Time in Additive Manufacturing Process Using Dual Nozzle
    Seung Yeop Baik, Ju Ho Park, Sang In Kang, In Hwan Lee
    Journal of the Korean Society for Precision Engineering.2021; 38(11): 879.     CrossRef
  • Optimization of Manufacturing Conditions of Pressure-Sensitive Ink Based on MWCNTs
    Sung-Chul Park, In-Hwan Lee, Yong-Hwan Bae, Ho-chan Kim
    Journal of the Korean Society of Manufacturing Process Engineers.2019; 18(8): 1.     CrossRef
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