With the development of 3D printing technology, its applications are expanding. However, 3D printed parts present a challenge in achieving high-quality surface roughness because of stair stepping problems. With the recent application of 3D printing in electronics and the visibility of flow in microfluidic systems, high-quality surface roughness is needed. Chemical mechanical polishing (CMP), one of semiconductor fabrication processes, has the longest planarization length in terms of productivity among existing planarization methods. In this study, we investigate friction characteristics of polishing of ABSLike resin material printed by the Stereolithography Apparatus (SLA). At the polishing of ABS-Like resin, the friction force has a high value at the beginning of polishing, but it stabilizes as processing progresses because of the effect of waviness on the printed material. The surface roughness (Sa and Sz) reduction and the glossiness of ABS-Like resins after polishing appear to be related to the reduction of the Shore D hardness resulting from the rise in the polishing process temperature caused by friction during polishing.