Among the types of new and renewable energy, perovskite solar cells, which are next-generation solar cells, are capable of a solution process at a low temperature of 200oC or less, and have the advantages of high efficiency and low cost; hence, many studies have been conducted. Research has been performed on perovskite solar cells mainly produced using spin coating, but they have a disadvantage of occurrence of pinholes and cracks when fabricated over a large area, reducing the uniformity and density of the thin film. For the production of large-area perovskite solar cells, research is underway using solution shearing process technology among printed electronic process technologies, and most of the processes have been carried out at low speeds. This is due to the size of the crystal, which is one of the most important factors of high efficiency of the solar cell. When printing at high speed for mass production, the size of the crystal is reduced, resulting in charge loss and lower efficiency, making it difficult to apply the roll-to-roll process. In this study, to apply the roll-to-roll process for mass production, perovskite crystallization experiments were performed under high-speed conditions and crystal size changes according to meniscus stability.

Among the various next-generation solar cells, a perovskite solar cell can solve the economic problem because it can perform the low temperature solution process and the material is inexpensive. Photovoltaic conversion efficiency is comparable to silicon solar cells and thin-film solar cells. However, to commercialize the perovskite solar cells, there are many problems to be resolved, such as stability, upscaling, and efficiency. Thus, in this study, perovskite crystallization experiments were conducted according to the coating conditions such as the coating speed of the meniscus solution sheared coating process, and large-area perovskite solar cells with p-i-n structures were fabricated. Perovskite crystallization is one of the crucial factors that determine the efficiency of solar cells, and it is an integral process condition for manufacturing large-area perovskite solar cells.

The heat-sealing strength of pouch film greatly affects the reliability of the lithium ion secondary battery. In this paper, the researchers investigated and evaluated the properties of the heat-sealing strength of pouch film, such as heat, pressure, time, thickness of the heat-seal, and the polypropylene material. The heat-sealing strength showed a high value at 180℃ for 3 seconds. However, under the conditions of higher temperatures and longer times, deformation and bulging of polypropylene were observed. The heat-sealing strength tended to increase when decreasing heat-seal thickness. The heat-sealing strength varied according to the type of polypropylene. In addition, to avoid defects that may have occurred in the process of manufacturing the lithium ion secondary battery, the heat-sealing strength in the state where the impurities remained was evaluated.

This paper studied the adhesive strength and electrolyte resistance of the pouch film according to the kind of the extruded resin, which is the basis of the numerous variables in extrusion lamination. After preparing a pouch film by using various extruded resins, we measured the adhesive strength and electrolyte resistance between the aluminum foil and the CPP film. The minimal difference was observed between the adhesive strength with the extruded resin. Also, the extruded resin used in the experiment did not satisfy the electrolyte resistance. An electrolyte resistance was obtained by addition of the functional resin to the extruded resin. The addition of functional resins resulted in improved adhesive strength and electrolyte resistance, that were measured to be approximately 1300 gf/15 mm and 800 gf/15 mm, respectively, at 85℃ for 7days.

In this study, the intention is the determination of the optimum laminate conditions for the improvement of the chemical resistance of the aluminum-pouch films that are widely used as a packaging material for the secondary battery. Here, the properties including the initial adhesive strength and the electrolyte resistance between the metal-film layer with aluminum and the sealant layer with cast polyprophylene (CPP) film were investigated. Regarding the lamination condition, the lamination temperature, speed, and pressure conditions were changed. A roll-to-roll dry lamination-coating system was used in the surface-treatment agent coating, adhesive coating, and film lamination. For the lamination conditions of the aluminum and CPP films, the initial adhesive strength of the laminated-pouch film manufactured with a 110oC temperature and a 6.0 M/min line speed is 1200 gf/15 mm. The measured adhesive strength of the 85oC electrolyte resistance after its immersion for 7 days is 600 gf/15 mm.

Pouch film is manufactured by laminating aluminum foil, polyamide film and polypropylene film with an adhesive or extrusion resin. However, a surface treatment is required for the aluminum because bonding does not occur easily between the aluminum foil and the polymer film. Thus, for this study, surface treatment experiments were performed in order to confirm the effect on adhesion strength. First, a variety of surface treatment solutions were coated on aluminum foil, and contact angle and surface morphology analysis was carried out for the surface-treated aluminum. For lamination of the surface-treated aluminum foil with polyamide film, a polyurethane base adhesive was prepared for the adhesive strength test specimens. The adhesive strength between the aluminum foil and the polyamide film of the resulting specimens was measured (UTM). With such an experiment, it was possible to evaluate the effect on adhesive strength of the various surface treatments.

In this study, we investigated the adhesive strength by molecular weight, mixture ratio, coating thickness, lamination temperature and aging condition of adhesive in manufacture process of Nylon-Aluminum for secondary aluminum pouch. It found that as the molecular weight of adhesive gets lower, the adhesive strength increases. In the mixture ratio, as the content of hardener get higher and as the content of solvent get lower, the adhesive strength increases. Also, as the coating thickness of adhesive get thicker, the adhesive strength increase. In addition, the adhesive strength is higher at 90 degrees of lamination temperature. So, it found that 90 degrees of lamination temperature is appropriate. In the aging condition when aged for 5 days, it found that the reaction and curing of adhesive is sufficient by measuring the adhesive strength.

In an Additive Manufacturing (AM) system emplying the Powder Bed Fusion (PBF) system, polyamide-12 powder is currently recognized as the general material used. The Polyamide-12 powder’s properties include an average particle size of 58 ㎛, a density of 0.59 g/㎤, and melting point of 184℃, and can also be to used coat materials for metal powder. For this reason, the sintering process is similar to the polymer powder and polymer coated metal powder process, except during the post-process. The polyamide-12 powder has some disadvantages such as its high cost and the fact that it can only be used for the provided equipment from the maker. Therefore, this study aims to perform the applicability of new material, polymer and polymer coated metal, to the PBF system.

The laser Powder Bed Fusion (PBF) system is currently recognized as a leading process. Due to the various materials employed such as thermoplastic, metal and ceramic composite powder, the application’s use extends to machinery, automobiles, and medical devices. The PBF system’s surface quality of prototypes and processing time are significantly affected by several parameters such as laser power, laser beam size, heat temperature and laminate thickness. In order to develop a more elaborate and rapid system, this study developed a new PBF system and sintering process. It contains a 3-axis dynamic focusing scanner system that maintains a uniform laser beam size throughout the system unlike the fθ lens. In this study, experiments were performed to evaluate the effects of various laser scanning parameters and fabricating parameters on the fusion process, in addition to fabricating various 3D objects using a PA-12 starting material.

Recently, studies of 3D printing methods have been working in various applications. For example, the powder base method laminates the prints by using a binding or laser sintering method. However, the draw back of this method is that the post process is time consuming and does not allow for parts to be rapidly manufactured. The binding method requires the post process while the time required for the post process is longer than the manufacturing time. This paper proposes a UV curing binding method with an integrated piezo printing head system. The optimization of an arbitrary waveform generation for the control of a UV curable resin droplet was researched, in addition to developed optimized UV curing processes in multi nozzle ink jet heads.

Previously fabricated electronic devices were used for vacuum manufacturing processes such as conventional semiconductor manufacturing. However, they are difficult to apply to continuous processes such as roll-to-roll printing, which results in very high device manufacturing and processing costs. Therefore, many developers have been interested in applying continuous processes to contact printing or noncontact printing technologies and they proposed various continuous printing techniques instead of conventional batch coating. In this paper, we proposed improved gravure offset printing process as one of the contact printing technique. We used etching pattern geometry with soft core blanket roll for printing of ultra fine line below the 10um.Using this technique we obtained flexible metal grid mesh film as transparent conductive film.

Printed electronics devices are made of several sets of printed patterns. The quality or printability of the printed patterns determines the electrical performance of such devices. Moreover, control of the printability determines the reliability of such devices. Despite its importance, few studies have been reported for the measurement of the printed patterns to evaluate their printability. In this study, a measurement method is proposed for printed patterns, including the definition of the properties to be measured, and the related software is described. The proposed method measures the width, pinholes, and edge waviness and evaluates the printability of the patterns quantitatively. The proposed measurement method could be an efficient tool to evaluate and enhance the printability of printed patterns in printed electronics.

Register control of roll-to-roll printing system for printed electronics requires accurate measurement of register errors. The register marks used for the recognition of patterns position between layers have inherently defects due to low printability of register marks themselves, which brings out inaccurate register accuracy and consequently low performance of printed electronics devices. In this study, the compensation methods for the unrecognized or missing register data are proposed to improve the recognition and consequently the control performance of register accuracy in roll-to-roll printing equipment. The compensation methods using the prior data and the linear interpolation are proposed and compared with the case without compensation for the simulation as well as experiment. Only the linear interpolation method could successfully compensate the missing data and consequently improve the register control performance. We should apply the compensation process of the register errors to improve the register control accuracy in the roll-to-roll printing equipment.

Silver (Ag) grid patterned PET substrates were manufactured by thermal roll-imprinting methods. We coated highly conductive layer (HCL) as a supply electrode on the Ag grid patterned PET in the three kinds of conditions. One was no-HCL without conductive PEDOT:PSS on the Ag grid patterned PET substrate, another was thin-HCL coated with ~50 nm thickness of conductive PEDOT:PSS on the Ag grid PET, and the other was thick-HCL coated with ~95 nm thickness of conductive PEDOT:PSS. These three HCLs in order showed 73.8%, 71.9%, and 64.7% each in transmittance, while indicating 3.84 Ω/□, 3.29 Ω/□, and 2.65 Ω/□ each in sheet resistance. Fabrication of organic solar cells (OSCs) with HCL Ag grid patterned PET substrates showed high power conversion efficiency (PCE) on the thin-HCL device. The thick-HCL device decreased efficiency due to low open circuit voltage (V<SUB>OC</SUB>). And the Ag grid pattern device without HCL had the lowest energy efficiency caused by quite low short current density (J<SUB>SC</SUB>).

In many electro-devices, the vacuum process is used as the manufacturing process. However, the vacuum process has a problem, it is difficult to apply to a continuous process such as a R2R(roll to roll) printing process. In this paper, we propose an ESD (electro static deposition) printing process has been used to apply an organic solar cell of thin film forming. ESD is a method of liquid atomization by electrical forces, an electrostatic atomizer sprays micro-drops from the solution injected into the capillary with electrostatic force generated by electric potential of about several tens kV. The organic solar cell based on a P3HT/PCBM active layer and a PEDOT:PSS electron blocking layer prepared from ESD method shows solar-to-electrical conversion efficiency of 1.42% at AM 1.5G 1sun light illumination, while 1.86% efficiency is observed when the ESD deposition of P3HT/PCBM is performed on a spin-coated PEDOT:PSS layer.