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"Electroplating"

Article
Process for the Fabrication of Nickel Material High Aspect-ratio Digital PCR Partition
GeeHong Kim, HyungJun Lim, SoonGeun Kwon, Hak-Jong Choi
J. Korean Soc. Precis. Eng. 2024;41(8):663-668.
Published online August 1, 2024
DOI: https://doi.org/10.7736/JKSPE.024.059
This paper outlines the fabrication process of the partition component, a crucial element in digital PCR. The partition component consists of thousands of micro-wells capable of holding small volumes of reagents. In this study, the partition component was created in a honeycomb structure, with hexagonally shaped micro-wells measuring 100 μm in size and spaced 20 μm apart. The fabrication process involved using photolithography, lift-off, and electroplating techniques. Photolithography and lift-off processes were employed to create a pattern of Cu metal layers in a hexagonal honeycomb arrangement on a glass substrate. Subsequently, the Cu metal-patterned substrate was used to produce pillar patterns of SU-8 with a high aspect ratio using photolithography. Finally, the gaps between the SU-8 pillar patterns were filled with nickel through electroplating, completing the partition component. The micro-wells in the partition component were designed to have an aspect ratio of 4-5; however, in this study, micro-wells with an aspect ratio of 2 and a depth of 200 μm were fabricated.
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