Micro hole drilling in precision production industries requires smaller holes, higher aspect ratios, and higher working speeds. However, the undesirable characteristics of micro drilling are small signal to noise ratios, wandering drill motion, high aspect ratio, and increasing cutting quality as cutting depth increases. In this study, two different types of experiments are performed on single crystal silicon to decrease crack formation. The first experiment compares the efficiency of various micro hole machining processes using ultrasonic impact grinding and micro drilling. The second experiment suggests optimum conditions for the micro drilling process. The experimental results show that micro drilling technology can be effectively used for drilling single crystal silicon.