Recently, as the interest in 3D printing technology has increased, many efforts have been initiated to apply 3D printing technology to various industrial fields. The 3D printing technology is also widely applied in medical, electronics, and apparel industries. Many studies on 3D printing have focused on equipment and material development. However, to use 3D printed components, it is necessary to understand friction and wear phenomenon that will occur during relative motion between two bodies. In this study, friction and wear characteristics of ABS (Acrylonitrile butadiene styrene)-like resin printed with the SLA (Stereo Lithography Apparatus) method were studies by using pin-on-disk and ball-on-disk methods. We also compared friction and wear characteristics between ABS-like resin-SUS304 and ABS-like resin-ABS-like resin. As a result, the relative motion between the ABS-like resin and SUS304 showed lower friction coefficient and wear amount than between the ABSlike resins. Markedly high frictional heat was observed because of the friction by the relative motion between the ABS-like resins. Experimental results show that further research on suitable lubricants is required to use 3D printed ABS-like resin parts as mechanical components.

Chemical mechanical polishing achieves surface planarity through combined mechanical and chemical means. The role of the chemical reaction is very important in a metal CMP like aluminum. The slurry used in aluminum CMP typically consists of oxidizers, a chelating agent, corrosion inhibitors, and abrasives. This study investigates the effect of oxalic acid as a chelating agent for aluminum CMP with H2O2. To study the chemical effect of the chelating agent, the two methods of a polishing experiment and an electrochemical analysis were used. Lastly, it was confirmed that the optimum concentration of oxalic acid significantly improved the removal rate and surface roughness of aluminum.

Mask manufacturing is a high COC and COO process in developing of semiconductor devices because of mask production tool with high resolution. Direct writing has been thought to be the one of the patterning method to cope with development or small-lot production of the device. This study consists two categories. One is the additional process of the direct and maskless patterning generation using SLA for easy and convenient application and the other is a removal process using wet-etching process.
In this study, cured status of epoxy pattern is most important parameter because of the beer-lambert law according to the diffusion of UV light. In order to improve the contact force between patterns and substrate, prime process was performed and to remove the semi-cured resin which makes a bad effects to the pattern, spin cleaning process using TPM was also performed. At a removal process, contact force between photo-curable resin as an etching mask and Si wafer is important parameter.