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"Jonghyeok Chae"

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"Jonghyeok Chae"

Articles
Machine Learning-based Classification of Acoustic Emission Signals in SiC Cathode Ultrasonic Machining Process
Minkeon Lee, Iljoo Jeong, Jonghyeok Chae
J. Korean Soc. Precis. Eng. 2025;42(6):431-439.
Published online June 1, 2025
DOI: https://doi.org/10.7736/JKSPE.025.017
This study analyzed acoustic emission (AE) signals generated during ultrasonic machining of SiC cathodes and evaluated classification performances of various machine learning models. AE data were collected in both waveform and hit formats, enabling signal characterization through statistical analysis and frequency domain examination. Various machine learning models, including XGBoost, KNN, Logistic Regression, SVM, and MLP, were applied to classify machining states. Results showed that XGBoost achieved the highest classification accuracy across all sensor positions, particularly at the upper part of the worktable with an accuracy of 98.35%. Additional experiments confirmed the consistency of these findings, highlighting the influence of sensor placement on classification performance. This study demonstrates the feasibility of monitoring AE-based machining state using machine learning and emphasizes the importance of sensor placement and signal analysis in improving classification accuracy. Future research should incorporate defect data and deep learning approaches to further enhance classification performance and process monitoring capabilities.
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Large-area Inspection Method for Machined Micro Hole Dimension Measurement Using Deep Learning in Silicon Cathodes
Jonghyeok Chae, Dongkyu Lee, Seunghun Oh, Yoojeong No
J. Korean Soc. Precis. Eng. 2025;42(2):139-145.
Published online February 1, 2025
DOI: https://doi.org/10.7736/JKSPE.024.117
In this study, we propose a deep learning-based method for large-area inspection aimed at the high-speed detection of micro hole diameters. Micro holes are detected and stored in large images using YOLOv8, an object detection model. A super-resolution technique utilizing ESRGAN, an adversarial neural network, is applied to images of small micro holes, enhancing them to high resolution before measuring their diameters through image processing. When comparing the diameters measured after 8x super-resolution with the results from existing inspection equipment, the average error rate is remarkably low at 0.504%. The time taken to measure an image of one micro hole is 0.470 seconds, which is ten times faster than previous inspection methods. These results can significantly contribute to high-speed measurement and quality improvement through deep learning.

Citations

Citations to this article as recorded by  Crossref logo
  • A Review of Intelligent Machining Process in CNC Machine Tool Systems
    Joo Sung Yoon, Il-ha Park, Dong Yoon Lee
    International Journal of Precision Engineering and Manufacturing.2025; 26(9): 2243.     CrossRef
  • 58 View
  • 3 Download
  • Crossref