In this paper, theoretical and experimental studies were conducted on the cooling performance of a microchannel heat dissipation device with a manifold layer added. By adding 500 μm wide microchannels and manifold flow fields, the rheological properties of the cooling fluid were enhanced to improve the heat transfer performance. The size of the microchannel used for cooling was 40 × 40 × 5 mm, and was evaluated under a heat flux of 12.5-43.75 W/㎠ and a flow rate of 0.3-1.1 L /min conditions. As a result of the experiment, in the case of a microchannel heat sink of 500 μm compared to the existing heat sink, cooling was successfully performed under a heat flux condition of about four times
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Thermal Design of Heatsink for M.2 NVMe SSD Reliability Chan Ho Kim, Jinsung Rho, Joong Bae Kim Journal of the Korean Society for Precision Engineering.2023; 40(5): 389. CrossRef
In this study, design for additive manufacturing (DfAM) of release agent injection manifold for hot forging has been performed to achieve weight reduction and flow path optimization. The weight reduction of 53.5% was achieved, thereby enabling the application of stainless steel 316L, which has high strength and corrosion resistance. Lightweight manifolds using Al-Mg-10Si and SUS316L materials were fabricated by PBF-type metal 3D printer. The feasibility test showed that mold life was improved by 14% by solving residual release agent problem. In addition, the flow path optimization results suggested that the flow standard deviation of each outlet dropped sharply from 264 to 75 ㎤/s. This approach demonstrated that DfAM for release agent manifold could be applied to increase mold life and improve product quality and productivity for hot forging.
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