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"Material removal rate"

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"Material removal rate"

Articles
Micro Hole Machining Characteristics of Glassy Carbon Using Electrical Discharge Machining (EDM)
Jae Yeon Kim, Ji Hyo Lee, Bo Hyun Kim
J. Korean Soc. Precis. Eng. 2025;42(4):325-332.
Published online April 1, 2025
DOI: https://doi.org/10.7736/JKSPE.025.006
Glassy carbon (GC) has superior properties such as high corrosion resistance, heat resistance, and low adhesion to glass materials in a glass molding process (GMP). In addition, the demand for GC molds is increasing in various industries that require high precision of glass parts. However, GC is a difficult-to-machine material with high hardness and brittleness. Electrical discharge machining (EDM) can machine GC regardless of its strength or hardness. In this study, tungsten carbide (WC-Co) electrode was fabricated by wire electrical discharge grinding (WEDG). Characteristics of EDM of micro holes on GC were then analyzed. As capacitance and voltage increased, material removal rate (MRR) increased while machining time tended to decrease. However, at low voltages, short circuit and secondary discharge occurred, which increased the electrode wear rate (EWR). As a result, a D-shaped electrode that could prevent short circuit and debris accumulation was fabricated and a micro hole array was machined.
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Prediction of CMP Material Removal Rate based on Pad Surface Roughness Using Deep Neural Network
Jong Min Jeong, Seon Ho Jeong, Yeong Il Shin, Young Wook Park, Hae Do Jeong
J. Korean Soc. Precis. Eng. 2023;40(1):21-29.
Published online January 1, 2023
DOI: https://doi.org/10.7736/JKSPE.022.119
As the digitization of the manufacturing process is accelerating, various data-driven approaches using machine learning are being developed in chemical mechanical polishing (CMP). For a more accurate prediction in contact-based CMP, it is necessary to consider the real-time changing pad surface roughness during polishing. Changes in pad surface roughness result in non-uniformity of the real contact pressure and friction applied to the wafer, which are the main causes of material removal rate variation. In this paper, we predicted the material removal rate based on pressure and surface roughness using a deep neural network (DNN). Reduced peak height (Rpk) and real contact area (RCA) were chosen as the key parameters indicative of the surface roughness of the pad, and 220 data were collected along with the process pressure. The collected data were normalized and separated in a 3 : 1 : 1 ratio to improve the predictive performance of the DNN model. The hyperparameters of the DNN model were optimized through random search techniques and 5 cross-validations. The optimized DNN model predicted the material removal rate with high accuracy in ex-situ CMP. This study is expected to be utilized in data-driven machine learning decision making for cyber-physical CMP systems in the future.

Citations

Citations to this article as recorded by  Crossref logo
  • Precision Engineering and Intelligent Technologies for Predictable CMP
    Somin Shin, Hyun Jun Ryu, Sanha Kim, Haedo Jeong, Hyunseop Lee
    International Journal of Precision Engineering and Manufacturing.2025; 26(9): 2121.     CrossRef
  • Prediction of Normalized Material Removal Rate Profile Based on Deep Neural Network in Five-Zone Carrier Head CMP System
    Yonsang Cho, Myeongjun Kim, Munyoung Hong, Joocheol Han, Hong Jin Kim, Hyunki Kim, Hyunseop Lee
    International Journal of Precision Engineering and Manufacturing-Green Technology.2025; 12(3): 869.     CrossRef
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Effect of Slurry Film Thickness Variation according to Spray Range Using Ultrasonic Spray Nozzle on Material Removal Rate
Seongnyeong Heo, Seonho Jeong, Minji Kim, Youngwook Park, Haedo Jeong
J. Korean Soc. Precis. Eng. 2022;39(9):675-682.
Published online September 1, 2022
DOI: https://doi.org/10.7736/JKSPE.022.036
Most of the consumables used in the CMP (Chemical Mechanical Planarization) process are discarded because it is difficult to reuse them. Slurry accounts for most of the consumables, so research is being conducted to reduce the amount of slurry used. A previous study explains that when the same amount of slurry is injected, the material removal rate is improved when the slurry is injected wide and thin instead of the tube nozzle, which is the conventional slurry injection method. However, there was no change in the injection method due to the problems of the injection method suggested in previous studies and the lack of follow-up studies. Thus, in this paper, an injection method through an ultrasonic spray nozzle is proposed to improve the problems of the injection method proposed in previous studies. Additionally, it is intended to calculate the slurry film thickness according to the spraying range and to explain the effect of the film thickness on the material removal rate.
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