Silicon carbide (SiC) has been used as a material for semi-conductor, molds, and micro-electro-mechanical systems (MEMS) because of its superior thermal, electrical, and mechanical properties. However, micro machining of SiC is very challenging due to its hardness and brittleness. This paper presents an experimental study of micro hole drilling of SiC. In this study, polycrystalline diamond (PCD) was used as a tool to overcome the hardness of SiC. The micro PCD tool with a diameter of 110 μm was fabricated by micro electrical discharge machining (EDM). Micro drilling was conducted with varying machining parameters such as tool rotational speed and feed rate. Effects of surface roughness of the tool and lubrication method were also investigated.
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The mechanical drilling of micro holes is considered a difficult endeavor, due to the high hardness and brittleness of alumina plates found during the drilling process. In this work, an alumina plate with a 4mm thickness is drilled with the use of a continuous-wave Nd:YAG fiber laser. As can be seen, there is minimum required power density to ablate the alumina plate. As shown in this study, the hole diameter and straightness are not constant with the hole depth recorded, which is presumably due to the recondensation of vaporized alumina, and the characteristics of irregular laser radiation. The oxygen pressure, power density, focal position, and laser on time (duration) are chosen as the control parameters. To understand the influence of control parameters, the orthogonal arrays table in Taguchi method is applied, and the micro holes are evaluated based on the use of geometrical factors. Through the review of a sensitivity and interaction analysis, the appropriate duration and oxygen pressure are identified as the major parameters governing the geometrical quality of drilled holes in this study.
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Micro Drilling of Single Crystal SiC Using Polycrystalline Diamond Tool Ui Seok Lee, Chan Young Yang, Ju Hyeon Lee, Bo Hyun Kim Journal of the Korean Society for Precision Engineering.2021; 38(7): 471. CrossRef