Skip to main navigation Skip to main content
  • E-Submission

JKSPE : Journal of the Korean Society for Precision Engineering

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Page Path

1
results for

"Printed circuits"

Article category

Keywords

Publication year

Authors

"Printed circuits"

Article
A Study on the Shape of Printed Circuit to Minimize Line-width Change by Film Thermoforming
Du Yong Park, Ho Sang Lee
J. Korean Soc. Precis. Eng. 2023;40(9):759-765.
Published online September 1, 2023
DOI: https://doi.org/10.7736/JKSPE.023.069
In-Mold Electronics (IME) is a manufacturing method that integrates printed decorations and electronic circuitry with thermoforming and injection molding processes. The method enables the production of ergonomic, lightweight and durable parts through cost-effective processes that require less assembly. Herein, the effect of circuit shape on line-width change by thermoforming was investigated through experiments and analysis based on the K-BKZ nonlinear viscoelastic model. Two circuit shapes, a horseshoe and a coil, were proposed and their line widths after thermoforming were measured and compared to that of a straight line shape. In the horseshoe-shaped circuit, the line width decreased as the radius increased due to the influence of vertical stretching caused by thermoforming. However, the effect of the angle on the line width was insignificant. In the coil-shaped circuit, the width of the line decreased as the pitch increased. However, as the amplitude increased, the line width also increased, but the effect was not significant. For the circuit shapes of the straight line, horseshoe and coil shapes, the rate of change in line width was 4.4, 0.4, and 0.2%, respectively. After conducting research, it was found that the coil-shaped circuit is more effective in minimizing line-width change caused by film thermoforming.
  • 5 View
  • 0 Download