In this study, we investigated characteristics and mechanical properties of SKD61 repaired using the direct energy deposition (DED) process. Mechanical properties of the repaired product can vary depending on the base material and powder used in the DED process. To prepare for DED repairing for a damaged part, we conducted experiments using two different powders (H13 and P21). Experimental results showed that both powders were deposited without defects in the surface or interface between the deposited zone and the substrate. Hardness measurements indicated that the repaired region of the Repaired-H13 sample exhibited higher hardness than the base material, while the Repaired-P21 sample showed a sharp increase in hardness in the heat-affected zone (HAZ). Additionally, tensile test results revealed that the Repaired-H13 sample had lower tensile strength and elongation than the base material, whereas the Repaired-P21 sample demonstrated higher tensile strength and yield strength with a higher elongation than the Repaired-H13 sample. In case of Repaired-H13, it was confirmed that interfacial crack occurred due to a high hardness difference between the repaired part and the substrate.

We have developed a direct conductive patterning method with micro-scale line widths using the laser-induced-forward transfer (LIFT) and liquid metal. As this method does not need post-thermal processing, there is no thermal damage even on heat-sensitive polymer substrates by low-power laser irradiation on the dynamic release layer (DRL). Unlike other liquid metal patterning processes, this procedure can easily achieve fine line widths of a few tens of micrometers corresponding to laser spot size. The solid-state UV pulse laser with 266 nm wavelength and 20 ns pulse duration was used to transfer Eutectic Gallium Indium (EGaIn) liquid metal and the results for the single and multi-pulse laser irradiation were investigated to determine the effective process conditions. The applicability of flexible circuit fabrication and selective circuit repair was successfully tested on Polyimide (PI) substrate. After the LIFT process, the electrical properties of liquid metal on the pattern were measured to be approximately 5~8 x 10^-3 Ω/m of resistance.