In this study, pyrolytic graphite was applied to overcome the conventional cooling system. Pyrolytic graphite is an anisotropic material with high thermal conductivity in the X-Y direction and low thermal conductivity in the Z direction. The advantage of high thermal conductivity in the plane direction is applied to improve the performance of the cooling capacity transceiver module housing made of aluminum. In comparison with the housing using the aluminum, the housing applied to the PGS plate shows a higher cooling performance on the average temperature of chips and the temperature variations by 2.79% and 49.98%. The heat dissipation performance was investigated according to the thickness of the PGS and the via the shape. When the factor of thickness in PGS plate was “0.375”, the average temperature of the chip was the lowest, and the temperature variation decreased due to increasing the factor of thickness in the PGS plate. In the case of the via shape, the “separation plate” showed the lowest average temperature of chips and the “plate” showed the lowest temperature variation.