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JKSPE : Journal of the Korean Society for Precision Engineering

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"Sang Uk Lee"

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"Sang Uk Lee"

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Mobile Software Platform for Root Industry
Sang Uk Lee, Man Hui Yi
J. Korean Soc. Precis. Eng. 2017;34(1):13-17.
Published online January 1, 2017
DOI: https://doi.org/10.7736/KSPE.2017.34.1.13
The sectors of the Root industry include casting, plastic works, welding, surface treatment, and heat treatment. While the industry is concerned with the processing technologies that are used in most of the manufacturing industries, the sophistication of the corresponding manufacturing information systems is very low. This paper describes a manufacturing information system for the building sector for which the smartphone devices that the workers use in their daily lives are employed, and where the cost of the adaption of the manufacturing system at their factories is minimized. The proposed system consists of the following three parts: UI composer, General Application, and Gateway.
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Electrostatic Suspension System of Silicon Wafer using Relay Feedback Control
Jong Up Jeon, Sang Uk Lee
J. Korean Soc. Precis. Eng. 2005;22(10):56-64.
Published online October 1, 2005
A simple and cost-effective method for the electrostatic suspension of thin plates like silicon wafers is proposed which is based on a switched voltage control scheme. It operates according to a relay feedback control and deploys only a single high-voltage power supply that can deliver a DC voltage of positive and/or negative polarity. This method possesses the unique feature that no high-voltage amplifiers are needed which leads to a remarkable system simplification relative to conventional methods. It is shown that despite the inherent limit cycle property of the relay feedback based control, an excel1ent performance in vibration suppression is attained due to the presence of a relatively large squeeze film damping origination from the air between the electrodes and levitated object. Using this scheme, a 4­inch silicon wafer was levitated stably with airgap variation decreasing down to 1 1㎛ at an airgap of 100 ㎛.
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