Recently, various attempts have been made to apply the additive manufacturing technology directly to fabricate a product. In this regards, the industry is focusing on the multi-material additive manufacturing technology that can processes multiple materials simultaneously. This study is about the fabrication of a 3-dimensional circuit device (3DCD), based on the multimaterial additive manufacturing technology, which is combination of the material extrusion and the direct writing processes. The multi-material additive manufacturing system was developed based on the commercial multi-head FDM system. In addition, a contact type nozzle for the dispensing of the conductive material in the direct writing process is proposed. The 3-dimensional circuit device in which circuit elements are arranged on several layers was fabricated successfully, based on the presented multi-material additive manufacturing system.
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Application of Image Recognition Technology in Nozzle Cleaning for Material Extrusion Additive Manufacturing Processes Ho-Chan Kim, Yong-Hwan Bae, Hae-Yong Yun, In-Hwan Lee Journal of the Korean Society of Manufacturing Process Engineers.2024; 23(11): 20. CrossRef
Optimization Design of Student KSAE BAJA Knuckle Using SLM 3D Printer Young Woo Im, Geon Taek Kim, Hyeon Sang Shin, Kang Min Kim, Bu Hyun Shin, Jong Won Lee, Jinsung Rho Journal of the Korean Society for Precision Engineering.2023; 40(9): 719. CrossRef
Study on the Reduction of Food Fabrication Time in Additive Manufacturing Process Using Dual Nozzle Seung Yeop Baik, Ju Ho Park, Sang In Kang, In Hwan Lee Journal of the Korean Society for Precision Engineering.2021; 38(11): 879. CrossRef
Optimization of Manufacturing Conditions of Pressure-Sensitive Ink Based on MWCNTs Sung-Chul Park, In-Hwan Lee, Yong-Hwan Bae, Ho-chan Kim Journal of the Korean Society of Manufacturing Process Engineers.2019; 18(8): 1. CrossRef
Multi-material Additive Manufacturing (AM) is being focused to apply for direct manufacturing of a product. In this paper, a three-dimensional circuit device (3DCD) fabrication technology based on the multi-material AM technology was proposed. In contrast with conventional two-dimensional Printed Circuit Board (PCB), circuit elements and conducting wires of 3DCD are placed in threedimensional configuration at multiple layers of the structure. Therefore, 3DCD technology can improve design freedom of an electronic product. In this paper, 3DCD technology is proposed based on AM technology. Two types of 3DCD fabrication systems were developed based on the Stereolithography and the Fused Deposition Modeling technologies. And the 3DCD samples which have same function were fabricated, successfully.
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