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"Thermal conductivity"

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Effect of Thermal Conductivity of Coil Insulator Material on the Temperature Variation of High Voltage Motor
Jaehyun Park, Seung Ho Paek, Hyun Woo Lee, Heesung Park
J. Korean Soc. Precis. Eng. 2020;37(5):355-360.
Published online May 1, 2020
DOI: https://doi.org/10.7736/JKSPE.019.119
It has been an on-going issue to develop a high voltage motor with high capacity and reliability. In this study, we investigated the effective coil insulator materials in terms of thermal conductivity. To quantify the contribution of the coil insulator material, two different motors with and without the cooling structure were numerically studied. Based on the measured thermal conductivity of six different coil insulators, we have achieved the effectiveness of thermal conductivity. Consequently, the high voltage motor can be developed with the proposed effectiveness of thermal conductivity regarding coil insulator materials. Our study of fundamental material characteristics will be beneficial in enhancing thermal management technology of a high voltage motor.

Citations

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  • Improved thermal conductivity of anticorona insulation paint for high-voltage motor application
    Xia Zhao, Hui Zhang, Yongxin Sun, Tiandong Zhang
    Journal of Materials Science: Materials in Electronics.2023;[Epub]     CrossRef
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A Study of the Thermal Effectiveness of Pyrolytic Graphite Sheet in the Transmit Receive Module Housing
Sang Hyeok Ahn, Sung Hwan Yim, Jun Woo Park, Young Eun Ra
J. Korean Soc. Precis. Eng. 2020;37(2):99-106.
Published online February 1, 2020
DOI: https://doi.org/10.7736/JKSPE.019.093
In this study, pyrolytic graphite was applied to overcome the conventional cooling system. Pyrolytic graphite is an anisotropic material with high thermal conductivity in the X-Y direction and low thermal conductivity in the Z direction. The advantage of high thermal conductivity in the plane direction is applied to improve the performance of the cooling capacity transceiver module housing made of aluminum. In comparison with the housing using the aluminum, the housing applied to the PGS plate shows a higher cooling performance on the average temperature of chips and the temperature variations by 2.79% and 49.98%. The heat dissipation performance was investigated according to the thickness of the PGS and the via the shape. When the factor of thickness in PGS plate was “0.375”, the average temperature of the chip was the lowest, and the temperature variation decreased due to increasing the factor of thickness in the PGS plate. In the case of the via shape, the “separation plate” showed the lowest average temperature of chips and the “plate” showed the lowest temperature variation.

Citations

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  • Hybrid battery thermal management system coupled with paraffin/copper foam composite phase change material
    Seunghoon Lee, Hyoseong Lee, Yong Joo Jun, Hoseong Lee
    Applied Energy.2024; 353: 122043.     CrossRef
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