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"Ui Seok Lee"

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"Ui Seok Lee"

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Experimental Study on the Formation of Discharge Crater Morphology in Micro EDM
Jae Yeon Kim, Ui Seok Lee, Hee Jin Kong, Bo Hyun Kim
J. Korean Soc. Precis. Eng. 2026;43(1):61-68.
Published online January 1, 2026
DOI: https://doi.org/10.7736/JKSPE.025.072
As advanced materials with high hardness, strength, and heat resistance are increasingly applied in fields such as aerospace, semiconductors, biomedical engineering, and mold manufacturing, the demand for high-precision machining technologies is growing. Micro electrical discharge machining (Micro-EDM) has gained attention as a non-contact process that locally melts and vaporizes conductive materials using electrical sparks, allowing for the fabrication of intricate 3D microstructures with high precision. This study analyzes the impact of capacitance in RC-type discharge circuits on the machining characteristics of single discharge craters using aluminum, brass, copper, STS304, and WC-Co. Additionally, we compare the overlapping behavior and morphological evolution of multiple discharge craters across these materials. We investigated the diameter and depth of single discharge craters, as well as the geometrical characteristics of overlapped craters. The results demonstrate the influence of discharge energy and material properties on discharge crater geometry, providing a quantitative basis for analyzing surface morphology in the Micro-EDM process.
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Micro Drilling of Single Crystal SiC Using Polycrystalline Diamond Tool
Ui Seok Lee, Chan Young Yang, Ju Hyeon Lee, Bo Hyun Kim
J. Korean Soc. Precis. Eng. 2021;38(7):471-478.
Published online July 1, 2021
DOI: https://doi.org/10.7736/JKSPE.021.013
Silicon carbide (SiC) has been used as a material for semi-conductor, molds, and micro-electro-mechanical systems (MEMS) because of its superior thermal, electrical, and mechanical properties. However, micro machining of SiC is very challenging due to its hardness and brittleness. This paper presents an experimental study of micro hole drilling of SiC. In this study, polycrystalline diamond (PCD) was used as a tool to overcome the hardness of SiC. The micro PCD tool with a diameter of 110 μm was fabricated by micro electrical discharge machining (EDM). Micro drilling was conducted with varying machining parameters such as tool rotational speed and feed rate. Effects of surface roughness of the tool and lubrication method were also investigated.

Citations

Citations to this article as recorded by  Crossref logo
  • Micro Hole Machining Characteristics of Glassy Carbon Using Electrical Discharge Machining (EDM)
    Jae Yeon Kim, Ji Hyo Lee, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2025; 42(4): 325.     CrossRef
  • Prediction of Machining Conditions from EDMed Surface Using CNN
    Ji Hyo Lee, Jae Yeon Kim, Dae Bo Sim, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2024; 41(11): 865.     CrossRef
  • Machining Characteristics of Micro EDM of Silicon Carbide
    Ju Hyeon Lee, Chan Young Yang, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2024; 41(2): 131.     CrossRef
  • Study on Micro Grooving of Tungsten Carbide Using Disk Tool
    Min Ki Kim, Chan Young Yang, Dae Bo Sim, Ji Hyo Lee, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2024; 41(2): 123.     CrossRef
  • EDM Using Wire Electrical Discharge Milling Electrode
    Do Kwan Chung
    Journal of the Korean Society for Precision Engineering.2022; 39(1): 21.     CrossRef
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Micro Pin Fabrication of Tungsten Carbide Using Polycrystalline Diamond
Joo A Park, Ui Seok Lee, Bo Hyun Kim
J. Korean Soc. Precis. Eng. 2020;37(11):791-796.
Published online November 1, 2020
DOI: https://doi.org/10.7736/JKSPE.020.085
Micro tool fabrication is crucial in micro machining. Wire electro-discharge grinding (WEDG) is one of the popular methods applied to fabricate micro tools used for micro electrical discharge machining (EDM), electrochemical machining (ECM), and ultrasonic machining (USM). WEDG can machine micro tools or features regardless of workpiece hardness. In WEDG, however, the machining speed is relatively low and the discharge gap control is not easy. In this study, the micro mechanical machining using the polycrystalline diamond is introduced to fabricate the micro cylindrical tool or micro pin of the tungsten carbide. This method demonstrates the possibility of applying ductile machining of tungsten carbide without brittle fracture or cracks. This paper compared the machining characteristics such as material removal rate and surface roughness with the PCD-mechanical machining and WEDG.

Citations

Citations to this article as recorded by  Crossref logo
  • Micro Hole Machining Characteristics of Glassy Carbon Using Electrical Discharge Machining (EDM)
    Jae Yeon Kim, Ji Hyo Lee, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2025; 42(4): 325.     CrossRef
  • Machining Characteristics of Micro EDM of Silicon Carbide
    Ju Hyeon Lee, Chan Young Yang, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2024; 41(2): 131.     CrossRef
  • Study on Micro Grooving of Tungsten Carbide Using Disk Tool
    Min Ki Kim, Chan Young Yang, Dae Bo Sim, Ji Hyo Lee, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2024; 41(2): 123.     CrossRef
  • SEM Image Quality Improvement and MTF Measurement Technique for Image Quality Evaluation Using Convolutional Neural Network
    Chan Ki Kim, Eung Chang Lee, Joong Bae Kim, Jinsung Rho
    Journal of the Korean Society for Precision Engineering.2023; 40(4): 275.     CrossRef
  • EDM Using Wire Electrical Discharge Milling Electrode
    Do Kwan Chung
    Journal of the Korean Society for Precision Engineering.2022; 39(1): 21.     CrossRef
  • Micro Drilling of Single Crystal SiC Using Polycrystalline Diamond Tool
    Ui Seok Lee, Chan Young Yang, Ju Hyeon Lee, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2021; 38(7): 471.     CrossRef
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