A femtosecond laser is used in various fields such as microscale machining, OLED repair, micro 3D structure fabrication, and eye surgery. Particularly, because of non-thermal property, ablation and ablation threshold are the most representative characteristics of femtosecond laser. The ablation system is accompanied by many optics, stage, or gantry. In the case of the gantry, an ordinary optic system delivers a beam where mirrors and lens are required. If the gantry moves to the sample, external stimulation such as vibration will occur. Vibration has an influence on optics such as transforming beam path and becomes an error that decreases accuracy, precision, and spatial resolution. Generally, Fiber Optic Beam Delivery System (FOBDS) is used to solve this issue. But in the case of the femtosecond laser, FOBDS is incompatible. Recently, another FOBDS model that is compatible with the femtosecond laser has been developed. In this paper, the ablation threshold was obtained by FOBDS and femtosecond laser. The results present a possibility of ablation without external stimulation.

Recent research topics of ultra-precision micro, nano machining using femtosecond lasers are described in the paper.

The removal of tiny particles adhered to surfaces is one of the crucial prerequisite for a further increase in IC fabrication, large area displays and for the process in nanotechnology. Various cleaning techniques (wet chemical cleaning, scrubbing, pressurized jets and ultrasonic processes) currently used to clean critical surfaces are limited to removal of micrometer-sized particles. Therefore the removal of sub-micron sized particles from silicon wafers is of great interest. For this purpose various cleaning methods are currently under investigation. In this paper, we report on experiments on the cleaning effect of 100nm sized fluorescence particles on silicon wafer using the plasma shockwave occurred by femtosecond laser. The plasma shockwave is main effect of femtosecond laser cleaning to remove particles. The removal efficiency was dependent on the gap distance between laser focus and surface but in some case surface was damaged by excessive laser intensity. These experiments demonstrate the feasibility of femtosecond laser cleaning using 100nm size fluorescence particles on wafer.

Recently, the lead-time of a product is to be shortened in order to satisfy consumer's demand. It is thus important to reduce the manufacturing time and the cost of 3D-shaped microstructures. Micro-Electro-Mechanical Systems (MEMS) and devices are usually fabricated by lithography-based methods. Above method is not flexible for the rapid manufacture of 3D-shaped microstructures because it depends on work's experiences and requires excessive cost and time for making many masks. In this paper, the effective laser micromachining is developed to fabricate UV sensitive polymer microstructures using laser ablation. The proposed process, named by laser microRP, is a very useful method on rapid manufacturing for 3D-shaped microstructures.