Skip to main navigation Skip to main content
  • E-Submission

JKSPE : Journal of the Korean Society for Precision Engineering

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS
Article

The Behavior of Intrinsic Bubbles in Silicon Wafer Direct Bonding

Do-Min Moon, Hae-Do Jeong
JKSPE 1999;16(3):78-83.
Published online: March 1, 1999
  • 2 Views
  • 0 Download
  • 0 Crossref
  • 0 Scopus
prev next

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

Include:

The Behavior of Intrinsic Bubbles in Silicon Wafer Direct Bonding
J. Korean Soc. Precis. Eng.. 1999;16(3):78-83.   Published online March 1, 1999
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
The Behavior of Intrinsic Bubbles in Silicon Wafer Direct Bonding
J. Korean Soc. Precis. Eng.. 1999;16(3):78-83.   Published online March 1, 1999
Close