A high-resolution shadow mask, or called a nanostencil was fabricated for high resolution lithography. This high-resolution shadow mask was fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. 500 run thick and 2×2 ㎜ large membranes were made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 70 ㎜ could be made into the membrane. By local deposition through the apertures of nanostencil, nanoscale patterns down to 70 ㎜ could be achieved.
