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Effects of Change of Wafer Shape through Heating on Chemical Mechanical Polishing Process

Dae Hee Kwon, Hyoung Jae Kim, Hae Do Jeong
JKSPE 2003;20(1):85-90.
Published online: January 1, 2003
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Effects of Change of Wafer Shape through Heating on Chemical Mechanical Polishing Process
J. Korean Soc. Precis. Eng.. 2003;20(1):85-90.   Published online January 1, 2003
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Effects of Change of Wafer Shape through Heating on Chemical Mechanical Polishing Process
J. Korean Soc. Precis. Eng.. 2003;20(1):85-90.   Published online January 1, 2003
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