The sapphire wafer was polished by the implementation of the surface machining technology based on nano-tribology. The removal process has been performed by grinding, lapping and chemical-mechanical polishing. For the chemical mechanical polishing process, the chemical reaction between the slurry and sapphire wafer was investigated in terms of the change of Zeta-potential between two materials. The Zeta-potential was -4.98 ㎷ without the slurry in deionized water and was -37.05 ㎷ for the slurry solution. By including the slurry into the deionized water the Zeta-potential -29.73 ㎷, indicating that the surface atoms of sapphire become more repulsive to be easy to separate. The average roughness of the polished surface of sapphire wafer was ranged to 1-4Å.
