The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

Sung Hwan Kweon; Seol Ryung Kwon; Dong Jin Ko; Keum Saeng Park; Seung Han Yang

Articles

Page Path

Article

The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

Sung Hwan Kweon, Seol Ryung Kwon, Dong Jin Ko, Keum Saeng Park, Seung Han Yang

JKSPE 2008;25(6):7-12.

Published online: June 1, 2008

Author Affiliations

2 Views
0 Download
0 Crossref
0 Scopus

prev next

Full Article

Download PDF

Keywords: Flip chip bonding(플립 칩 본딩),Camera module(카메라 모듈),Heating tool(히팅 툴),Finite element method(유한 요소법),Anisotropic Conductive Film(이방성전도 필름)

Citations

Citations to this article as recorded by

Cite

CITE

export

Copy Download

Format

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
BibTeX — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

J. Korean Soc. Precis. Eng.. 2008;25(6):7-12. Published online June 1, 2008

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
bib — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

J. Korean Soc. Precis. Eng.. 2008;25(6):7-12. Published online June 1, 2008

Articles

Page Path

The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

Full Article

Citations

CITE

Download Citation

Format:

Include:

ABOUT

BROWSE ARTICLES

EDITORIAL POLICIES

FOR CONTRIBUTORS