The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

Sung Hwan Kweon; Seol Ryung Kwon; Dong Jin Ko; Keum Saeng Park; Seung Han Yang

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플립칩 본딩 공정에서의 압접면 온도 분포 최소화를 위한 히팅 툴 형상 최적화의 실험적 검증

권성환, 권설령, 고동진, 박금생, 양승한

The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

Sung Hwan Kweon, Seol Ryung Kwon, Dong Jin Ko, Keum Saeng Park, Seung Han Yang

JKSPE 2008;25(6):7-12.

Published online: June 1, 2008

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Keywords: Flip chip bonding(플립 칩 본딩),Camera module(카메라 모듈),Heating tool(히팅 툴),Finite element method(유한 요소법),Anisotropic Conductive Film(이방성전도 필름)

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The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

J. Korean Soc. Precis. Eng.. 2008;25(6):7-12. Published online June 1, 2008

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The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

J. Korean Soc. Precis. Eng.. 2008;25(6):7-12. Published online June 1, 2008

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플립칩 본딩 공정에서의 압접면 온도 분포 최소화를 위한 히팅 툴 형상 최적화의 실험적 검증

The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface

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