Freestanding hydride vapor phase epitaxy grown GaN(Gallium Nitride) substrates subjected to various polishing methods were characterized for their surface and subsurface conditions. Although CMP(Chemical Mechanical Polishing) is one of the best approaches for reducing scratches and subsurface damages, the removal rate of Ga-polar surface in CMP is insignificant(0.1-0.3㎛/hr) as compared with that of N-polar surface. Therefore, conventional MP(Mechanical Polishing) is commonly used in the GaN substrate fabrication process.
MP of (0001) surface of GaN has been demonstrated using diamond slurries with different abrasive sizes. Diamond abrasives of size ranging from 30㎚ to 100nm were dispersed in ethylene glycol solutions and mineral oil solutions, respectively. Significant change in the surface roughness (Ra 0.15㎚) and scratch-free surface were obtained by diamond slurry of 30㎚ in mean abrasive size dispersed in mineral oil solutions. However, MP process introduced subsurface damages confirmed by TEM (Transmission Electronic Microscope) and PL(Photo-Luminescence) analysis.
