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Glass Drilling using Laser-induced Backside Wet Etching with Ultrasonic Vibration

Hye Mi Kim, Min Soo Park
JKSPE 2014;31(1):75-81.
Published online: January 1, 2014
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Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy

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Glass Drilling using Laser-induced Backside Wet Etching with Ultrasonic Vibration
J. Korean Soc. Precis. Eng.. 2014;31(1):75-81.   Published online January 1, 2014
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Glass Drilling using Laser-induced Backside Wet Etching with Ultrasonic Vibration
J. Korean Soc. Precis. Eng.. 2014;31(1):75-81.   Published online January 1, 2014
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