Micro-sized Peltier coolers are generally employed for uniformly distributing heat generated in the multi-chip packages. These coolers are commonly classified into vertical and planar devices, depending on the heat flow direction and the arrangement of thermoelectric materials on the used substrate. Owing to the strong need for evaluation of performance of thermoelectric modules, at present an establishment of proper theoretical model has been highly required. The design theory for micro-sized thermoelectric cooler should be considered with contact resistance. Cooling performance of these modules was significantly affected by their contact resistance such as electrical and thermal junction. In this paper, we introduce the useful and optimal design model of small dimension thermoelectric module.
