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Basic Research For The 3DCD (3D Circuit Devices)

Hae Yong Yun, Ho Chan Kim
JKSPE 2014;31(12):1061-1066.
Published online: December 1, 2014
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Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

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Basic Research For The 3DCD (3D Circuit Devices)
J. Korean Soc. Precis. Eng.. 2014;31(12):1061-1066.   Published online December 1, 2014
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Basic Research For The 3DCD (3D Circuit Devices)
J. Korean Soc. Precis. Eng.. 2014;31(12):1061-1066.   Published online December 1, 2014
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