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반도체 공정용 초음파 유량계의 약액 내 버블에 의한 진폭 감쇠 계측 안정성 향상 연구

Improvement of Measuring Stability of Amplitude Attenuation by the Bubble in Ultrasonic Flow-Meter for Semiconductor Process

Journal of the Korean Society for Precision Engineering 2019;36(9):843-849.
Published online: September 1, 2019

1 극동대학교 반도체장비공학과

2 충북대학교 기계공학과

1 Department of Semiconductor Equipment Engineering, Far East University

2 School of Mechanical Engineering, Chungbuk National University

#E-mail: eungsuk@cbna.ac.kr, TEL: +82-43-266-8789
• Received: December 18, 2018   • Revised: May 14, 2019   • Accepted: May 23, 2019

Copyright © The Korean Society for Precision Engineering

This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

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  • Investigation on the influence of wall thickness on the reception signal in a PFA-made ultrasonic flow sensor
    Liang Hu, Chengwei Liu, Rui Su, Weiting Liu
    Sensor Review.2024; 44(2): 149.     CrossRef
  • Control Speed Improvement of Chemical Liquid Flow Control Device for Semiconductor Manufacturing Process
    Il Jin Bae
    Journal of the Korean Society for Precision Engineering.2021; 38(6): 405.     CrossRef

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Improvement of Measuring Stability of Amplitude Attenuation by the Bubble in Ultrasonic Flow-Meter for Semiconductor Process
J. Korean Soc. Precis. Eng.. 2019;36(9):843-849.   Published online September 1, 2019
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Improvement of Measuring Stability of Amplitude Attenuation by the Bubble in Ultrasonic Flow-Meter for Semiconductor Process
J. Korean Soc. Precis. Eng.. 2019;36(9):843-849.   Published online September 1, 2019
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Improvement of Measuring Stability of Amplitude Attenuation by the Bubble in Ultrasonic Flow-Meter for Semiconductor Process
Image Image Image Image Image Image Image Image Image Image Image Image Image Image Image
Fig. 1 Flow meter for semiconductor manufacturing process equipment
Fig. 2 Ultra sonic flow-meter block diagram
Fig. 3 Ultra sonic flow-meter detector decomposition
Fig. 4 Ultra sonic flow-meter detector and converter developed in this study
Fig. 5 Piezo ceramic and sound wave of ultra sonic flow-meter principle
Fig. 6 Zero-crossing block diagram of ultra sonic flow measurement
Fig. 7 Ultrasonic waveform zero crossing method
Fig. 8 The amount of bubbles in the tube over time
Fig. 9 Waveform changes according to bubble amount
Fig. 10 Result graph of wave sensitivity and flow rate
Fig. 11 Micro-bubble experiment system
Fig. 12 Number of bubble for different bubble size according to the amount of air volume
Fig. 13 Flow rate for maximum measuring time by the different supplied micro-bubble air volume (cc)
Fig. 14 An example of waveform changing steps due to the micro-bubble inflow until the error signal happen
Fig. 15 Micro-bubbles mixed with a large size of bubbles in flow-meter tube
Improvement of Measuring Stability of Amplitude Attenuation by the Bubble in Ultrasonic Flow-Meter for Semiconductor Process

Number of micro-bubble according to air volume in bubble generator

Amount of air (cc) supplied
in bubble generator
0 100 200 300
Number of bubble (ea/cc)
appeared in flow-meter
2,860 31,500 27,500 25,000

Comparison of the maximum measuring time (sec) of ultra sonic flow-meter by the supplied air volume

Supplied air(cc) in
bubble generator
100 200 300
Developed flow-meter 25 47 29
Japan make T flow-meter 24 20 20
Table 1 Number of micro-bubble according to air volume in bubble generator
Table 2 Comparison of the maximum measuring time (sec) of ultra sonic flow-meter by the supplied air volume