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"마이크로 패터닝"

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"마이크로 패터닝"

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Emerging Patterning Strategies for Intrinsically Stretchable Conductors: Materials, Architectures, and Device-level Performance
Donghyeon Seo, Seongsik Jeong, Hae-Jin Kim
J. Korean Soc. Precis. Eng. 2025;42(10):789-816.
Published online October 1, 2025
DOI: https://doi.org/10.7736/JKSPE.D.25.00003

Intrinsically stretchable electronics enable seamless integration with dynamic biological tissues and curved surfaces, making them vital for next-generation wearables, biointerfaces, and intelligent robotics. Yet, precise, high-resolution patterning of stretchable electrodes and circuits remains challenging, limiting practical applications. Traditional lithography offers excellent resolution but is hindered by thermal and chemical incompatibilities with soft substrates. Consequently, alternative approaches such as soft lithography, laser-based patterning, printing methods, and electrospray deposition have gained importance. Soft lithography provides an economical, low-temperature option suitable for delicate materials like liquid metals. Laser-based techniques deliver high resolution and design flexibility but require careful parameter tuning for specific substrates. Mask-free printing methods, including direct ink writing and inkjet printing, enable versatile patterning of complex geometries, while electrospray deposition supports precise, non-contact patterning on stretchable surfaces. Collectively, these techniques advance the fabrication of robust stretchable displays, wireless antennas, and bioelectronic interfaces for accurate physiological monitoring. Despite progress, challenges persist, particularly in achieving large-area uniformity, multilayer stability, and sustainable processing. Addressing these issues demands interdisciplinary collaboration across materials science, fluid dynamics, interfacial engineering, and digital manufacturing. This review highlights recent progress and remaining hurdles, offering guidance for future research in stretchable electronics.

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Recent Research Trend of Micro Hot-Embossing
Seung-Hyun Lee, Jeongdai Jo, Kwang-Young Kim, Young-Man Choi
J. Korean Soc. Precis. Eng. 2018;35(11):1027-1034.
Published online November 1, 2018
DOI: https://doi.org/10.7736/KSPE.2018.35.11.1027
Micro hot-embossing is a powerful tool in the agile additive manufacturing industry. Its applications include optical components, micro-fluidic devices, MEMS, hydrophobic/hydrophilic surfaces, and energy harvesting devices. To overcome a drawback of low-process speed, the R2R process has been innovated, with novel embossing mechanisms and process optimization. Also, new materials beyond thermoplastic polymers have been applied to develop new devices, or enhance device performance. This review surveys recent progress in micro hot-embossing technology, in terms of new mold fabrication process, process innovation, and various applications.

Citations

Citations to this article as recorded by  Crossref logo
  • Manufacturing Process for Highly Stable Thermal Imprinting Transparent Electrode Using IPL Sintering
    Yunseok Jang
    Journal of the Korean Society for Precision Engineering.2025; 42(1): 75.     CrossRef
  • Finding Ways to Deform Fine Patterns Fabricated by UV Curable Resin
    Woo Young Kim, Su Hyun Choi, Seonjun Kim, Young Tae Cho
    Journal of the Korean Society for Precision Engineering.2020; 37(4): 291.     CrossRef
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