Carbon Fiber Reinforced Plastic (CFRP) materials which are superlight in weight and have high strength have recently been applied in the automobile and aerospace industry, etc. to achieve high fuel efficiency. CFRP is termed as ‘difficult to cut material’ due to its unique material properties. It’s considered to be highly sensitive in processing due to its laminated structure which would pose some challenges such as delamination, Pull-out, Burr and Uncut. Due to this, it’s maintenance and treatment costs are high. There are also limitations in the conventional Gantry Machine in 3D shape cutting of CFRP materials. To counter this challenge, a robotic abrasive waterjet system with the following features has been developed and installed on site; a high-pressure pump, monitoring system and a catcher for 3D Shape cutting., It’s performance has been successfully proved. Based on the result, we discovered that a 6 axes robot could execute 3D shape cutting of car hood due to its high movement flexibility. In the future it is projected to fulfill more kinds of CFRP materials cutting test on many car brands.

Micro patterns are used to maximize the performance and efficiency of the product in many industries such as energy, display, printing, biology, etc. Nowadays, the fabrication technology for micro patterns has been developed in various ways such as photolithography, laser machining, electrical discharge machining and mechanical machining. Recently, mechanical machining the size of smaller than 1 micrometer could be tried, because the technology related to the machining was developed brilliantly. This paper shows the experiments using cutting processes in order to fabricate the micro pattern. Micro patterns of the size of several micrometers were machined by the diamond tools of two different shape, the deformation and generation of burr were investigated.

Ultrasonic grinding system is that the ultrasonic vibration by ultrasonic actuator is applied on conventional grinding system during grinding process. The Ultrasonic vibration with a frequency of over 20kHz can reduce grinding forces and increase surface quality, material removal rate (MRR) and grinding wheel life. In addition, ultrasonic vibration assisted grinding can be used for the materials that are difficult to cut. In this paper, methodology for ultrasonic tools is studied based on finite element method, and in turn the ultrasonic tools are designed and fabricated. It is found that the ultrasonic tool can vibrate with a frequency of 20kHz and amplitude of 25μm. In order to verify the machining performance, the grinding experiment is performed on titanium alloy. By applying ultrasonic vibration, the grinding force and temperature are reduced and MRR is increased compared with the conventional grinding.

??In order to cope with the requirements of smaller patterns, larger surfaces and lower costs in the fields of displays, optics and energy, greater attentions is now being paid to the development of micro-pattern machining technology. Compared with flat molds, roll molds have the advantages of short delivery, ease of manufacturing larger surfaces, and continuous molding. This paper presents the state-of-the-art of the micro pattern machining technology on the roll molds and introduces some research results on the machining process technology. The copper and nickel-phosphorous-alloy plating process, machining process technology for uniform micro patterns, micro cutting simulation and the real time monitoring system for micro machining are summarized. The developed technologies have led the complete localization of the prism sheets and will be applied to the direct forming process with succeeding research & development.

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.