In this study, we employed an infiltration technique to create a nanostructured functional layer, enhancing the electrochemically active area in solid oxide fuel cells (SOFCs). We infiltrated Pr₂NiO_4+δ (PNO) into a porous GDC electrolyte, resulting in a nanostructured catalytic layer. We characterized its microstructure and cross-sectional morphology using field-emission scanning electron microscopy (FE-SEM). The electrochemical performance was assessed at 750°C with a NiO-YSZ/YSZ/GDC half-cell configuration. The reference cell without PNO infiltration achieved a maximum power density of 2.07 W/cm², while the cell with 0.05 M PNO infiltration reached an improved value of 2.55 W/cm². These results demonstrate that by optimizing the infiltration concentration of PNO, we can fabricate a high-performance nanostructured functional layer without adding extra thickness, confirming infiltration as an effective strategy for enhancing SOFC performance.

This study presents a dual-impeller air-cooled heat exchanger aimed at improving thermal management in electro-optical tracking systems operating under high power density. Two geometric modifications were introduced to enhance flow characteristics and heat transfer performance: the curvature of the center plate and the integration of a pin-fin structure at the outlet. Through numerical simulation, the improved model demonstrated more efficient internal flow compared to the original model, achieved through enhanced inflow characteristics and reduced flow separation. The pin-fin structures induced localized turbulence and recirculation zones, contributing to an increased thermal exchange surface area and longer effective heat transfer time. Consequently, the outlet temperature of the internal system decreased by an average of 1.4°C across various rotational speeds, resulting in a 5.9% increase in heat exchanger efficiency compared to the original model. Overall, this study shows that structural enhancements in heat exchanger design can significantly improve the cooling performance of high-power electronic systems, suggesting practical applicability for advanced thermal management solutions.