Microholes with high aspect ratio are required in microstructures. Among various methods for producing the microhole, micro electrical discharge machining (MEDM) is very effective and useful process. But, it is difficult to machine the high aspect ratio holes below 100 ㎛ in diameter because machining condition becomes unstable due to bad removal of debris at deep hole. In this paper, ultrasonic vibration is applied to MEDM work fluid to make a high aspect ratio micro hole. It is shown that the vibration is effective in circulating the debris and increasing the machining rate. As a result, produced was a micro hole with 92 ㎛ entrance diameter, 81 ㎛ exit diameter and aspect ratio 23.