Technologies of TSV Filling and Solder Bumping for 3D Packaging

Sehoon Yoo; Young-Ki Ko; Yue-Seon Shin; Chang-Woo Lee

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Technologies of TSV Filling and Solder Bumping for 3D Packaging

Sehoon Yoo, Young-Ki Ko, Yue-Seon Shin, Chang-Woo Lee

JKSPE 2009;26(12):18-22.

Published online: December 1, 2009

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Keywords: Through Silicon Via (관통실리콘비아),Via Filling (비아충진),3D Package (3 차원 패키지),Solder Bonding (솔더본딩)

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Technologies of TSV Filling and Solder Bumping for 3D Packaging

J. Korean Soc. Precis. Eng.. 2009;26(12):18-22. Published online December 1, 2009

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Technologies of TSV Filling and Solder Bumping for 3D Packaging

J. Korean Soc. Precis. Eng.. 2009;26(12):18-22. Published online December 1, 2009

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