Numerical Study of Thermo-mechanical Stress on TSV

Jin Young Choi; Cha Gyu Song; Haeng Soo Lee; Sung Hoon Choa

Articles

Page Path

Article

Numerical Study of Thermo-mechanical Stress on TSV

Jin Young Choi, Cha Gyu Song, Haeng Soo Lee, Sung Hoon Choa

JKSPE 2009;26(12):23-31.

Published online: December 1, 2009

Author Affiliations

2 Views
0 Download
0 Crossref
0 Scopus

prev next

Full Article

Download PDF

Keywords: Multi Chip Package (멀티칩패키지),Through Silicon Via (관통 실리콘 비아),Thermo-mechanical Stress (열기계응력),Reliability (신뢰성)

Citations

Citations to this article as recorded by

Cite

CITE

export

Copy Download

Format

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
BibTeX — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

Numerical Study of Thermo-mechanical Stress on TSV

J. Korean Soc. Precis. Eng.. 2009;26(12):23-31. Published online December 1, 2009

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
bib — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

Numerical Study of Thermo-mechanical Stress on TSV

J. Korean Soc. Precis. Eng.. 2009;26(12):23-31. Published online December 1, 2009

Articles

Page Path

Numerical Study of Thermo-mechanical Stress on TSV

Full Article

Citations

CITE

Download Citation

Format:

Include:

ABOUT

BROWSE ARTICLES

EDITORIAL POLICIES

FOR CONTRIBUTORS