Fabrication of Through Silicon Via using Laser Drilling Process

Dongsig Shin; Jeong Suh; Jaehoon Lee; Kyunghan Kim

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Fabrication of Through Silicon Via using Laser Drilling Process

Dongsig Shin, Jeong Suh, Jaehoon Lee, Kyunghan Kim

JKSPE 2009;26(12):41-46.

Published online: December 1, 2009

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Keywords: TSV (실리콘 관통전극),Laser (레이저),Drilling (드릴링공정),DRIE (심도반응성이온식각공정),Hybrid Process (하이브리드 공정)

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Fabrication of Through Silicon Via using Laser Drilling Process

J. Korean Soc. Precis. Eng.. 2009;26(12):41-46. Published online December 1, 2009

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Fabrication of Through Silicon Via using Laser Drilling Process

J. Korean Soc. Precis. Eng.. 2009;26(12):41-46. Published online December 1, 2009

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