UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.
