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Volume 31(10); October 2014

Articles
ISB Bonding Technology for TSV (Through-Silicon Via) 3D Package
Jae Hak Lee, Jun Yeob Song, Young Kang Lee, Tae Ho Ha, Chang-Woo Lee, Seung Man Kim
J. Korean Soc. Precis. Eng. 2014;31(10):857-863.
Published online October 1, 2014
In this work, we introduce various bonding technologies for 3D package and suggest Insert-Bump bonding (ISB) process newly to stack multi-layer chips successively. Microstructure of Insert-Bump bonding (ISB) specimens is investigated with respect to bonding parameters. Through experiments, we study on find optimal bonding conditions such as bonding temperature and bonding pressure and also evaluate in the case of fluxing and no-fluxing condition. Although nofluxing bonding process is applied to ISB bonding process, good bonding interface at 270℃ is formed due to the effect of oxide layer breakage.
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Micro-bump Joining Technology for 3 Dimensional Chip Stacking
Young-Ki Ko, Yong-Ho Ko, Chang-Woo Lee
J. Korean Soc. Precis. Eng. 2014;31(10):865-871.
Published online October 1, 2014
Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a 50μm of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.
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Properties and Curing Behaviors of UV Curable Adhesives with Different Coating Thickness in Temporary Bonding and Debonding Process
Seung-Woo Lee, Tae-Hyung Lee, Ji-Won Park, Cho-Hee Park, Hyun-Joong Kim
J. Korean Soc. Precis. Eng. 2014;31(10):873-879.
Published online October 1, 2014
UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.
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Introduction to the Thin Film Thermoelectric Cooler Design Theories
Seong-jae Jeon, Bongkyun Jang, Jun Yeob Song, Seungmin Hyun, Hoo-Jeong Lee
J. Korean Soc. Precis. Eng. 2014;31(10):881-887.
Published online October 1, 2014
Micro-sized Peltier coolers are generally employed for uniformly distributing heat generated in the multi-chip packages. These coolers are commonly classified into vertical and planar devices, depending on the heat flow direction and the arrangement of thermoelectric materials on the used substrate. Owing to the strong need for evaluation of performance of thermoelectric modules, at present an establishment of proper theoretical model has been highly required. The design theory for micro-sized thermoelectric cooler should be considered with contact resistance. Cooling performance of these modules was significantly affected by their contact resistance such as electrical and thermal junction. In this paper, we introduce the useful and optimal design model of small dimension thermoelectric module.
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Study on the Development of the Digital Image Correlation Measurements Program for Measuring the 3-Point Bending Test
In Young Choi, Young June Kang, Kyung Min Hong, Kwang Su Ko, Sung Jong Kim
J. Korean Soc. Precis. Eng. 2014;31(10):889-895.
Published online October 1, 2014
Machine parts and structures of a change in the displacement and strain can be evaluated safety is one of the important factors. Typically the strain gauge has been employed to measure the displacement and strain. However, this contact-type measurement method has disadvantages that are not measured under condition of specific object shape, surface roughness and temperature. In particularly, 3 point bending and 4 point bending test not use strain gauge. So its test used cross head displacement and deflect meter. Digital Image Correlation measurement methods have many advantages. It is non contact-type measurement method to measure the object displacements and strain. In addition, it is possible to measure the Map of full field displacements and strain. In this paper, measured the 3 point bending deflection using the Digital Image Correlation methods. In order to secure the reliability, Digital Image Correlation method and universal test machine were compared.
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Dynamic Modeling of 2 DOF Parallel Manipulator
Jong Gyu Lee, Sang Ryong Lee, Choon Young Lee, Seung Han Yang
J. Korean Soc. Precis. Eng. 2014;31(10):897-904.
Published online October 1, 2014
In this paper, two-DOF parallel manipulator has the sliders which execute a linear reciprocating motion depending on parallel guides and the end-effector which can be adjusted arbitrarily. To investigate the dynamic characteristics of the manipulator, the dynamic performance index is used. The index is able to be obtained by the relation between the Jacobian matrix and the inertia matrix. The kinematic and the dynamic analysis find these matrices. Also, the dynamic model of the manipulator is derived from the Lagrange formula. This model represents complicated nonlinear equations of motion. With the simulation results of the dynamic characteristic of the manipulator, we find that the dynamic performance index is based on the selection of the ranges for the continuous movement of the manipulator and the dynamic model derived can be used to the control algorithm development of the manipulator.
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A Control System Using Butterworth Filter for Loss-in-Weight Feeders
In-Jae Kang, Sung-Min Moon, Joon Ho Kwon, Daehie Hong
J. Korean Soc. Precis. Eng. 2014;31(10):905-911.
Published online October 1, 2014
A Loss-in-Weight (LIW) feeder, a type of automated measuring device, is a continuous feeder used in many mass production industries. Due to its versatility, there have been constant demands of LIW feeders in food production supply lines as well as chemical and pharmaceutical industries. In this paper, the process of designing a LIW feeder system with better performance will be examined and compared with commercial products. This system is characterized by low pass Butterworth filter and feed forward PI control. The filter is for noise disposal caused by dynamic condition of a LIW feeder. The feed forward PI control, based on linearity feature of feeders, is adequate for stable driving of the system. At the end, a possible evaluation method of LIW system will be proposed to verify the specific achievement of this paper.
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Design of Robotic Prosthetic Leg for Above-knee Amputees
Un-Je Yang, Jung-Yup Kim
J. Korean Soc. Precis. Eng. 2014;31(10):913-922.
Published online October 1, 2014
This paper describes design of a robotic above-knee prosthetic leg which is powered by electrical motors. As a special feature, the robotic prosthetic leg has enough D.O.F.s. For mimicking the human leg, the robotic prosthetic leg is composed of five joints. Three of them are called ‘active joint’ which is driven by electrical motors. They are placed at the knee-pitch-axis, the ankle-pitchaxis, and the an! kle-roll-axis. Every ‘active joint’ has enough torque capacity to overcome ground reaction forces for walking and is backlashless for accurate motion generation and highperformance balance control. Other two joints are called ‘passive joint’ which is activating by torsion spring. They are placed at the toe part and designed by Crank-rocker mechanism using kinematic design approach. In order to verify working performance of the robotic prosthetic leg, we designed a gait trajectory through motion capture technique and experimentally applied it to the robot.
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Finite Element Analysis of an Elongation Rolling Process for Manufacturing Seamless Pipes
Seung Hyun Jung, Yoo In Shin, Chul Ki Song
J. Korean Soc. Precis. Eng. 2014;31(10):923-928.
Published online October 1, 2014
Elongation rolling process is an intermediate process to make the uniform thickness and uniform surface roughness during producing seamless pipes. The thickness and surface roughness of seamless pipes are generally affected by the distance of rolls and guide shoes, the roll shape, and its cross angle. In this study, finite element analysis for shape forming process is based on the analysis model of elongation rolling mill with guide shoes. This paper shows how the cross angle of the roll, the rolling rpm, and the distance of the guide shoe influence on the outer diameter and the thickness of seamless pipes. The rolling rpm did not give much influence on outer diameter.
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A Passive Reaction Force Compensation Mechanism for a Linear Motor Motion Stage using an Additional Movable Mass
DucCanh Nguyen, HyeongJoon Ahn
J. Korean Soc. Precis. Eng. 2014;31(10):929-934.
Published online October 1, 2014
Reaction force compensation (RFC) mechanism can relieve the vibration of base system caused by acceleration and deceleration of mover. In this paper, we propose a new passive RFC mechanism with a movable additional mass to reduce vibration of the system base as well as displacement of the magnet track. First, equation of motion for the new passive RFC mechanism is derived and simulated to tune design parameters such as masses and spring coefficients. Simulation results show that the vibration of the system base of the stage with the new RFC mechanism.
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A Numerical Study of Energy Mechanism for Development of Road Generator System
Suk Young Lee
J. Korean Soc. Precis. Eng. 2014;31(10):935-945.
Published online October 1, 2014
This paper presents a new road generative system that employs a pad of preventive overspeed or tollgate. The system consists of pad, shaft, torsional damper, oneway-clutch, gear system, and electricity generator components. When the car driven through the road generation system, it occurred to surplus energy in the DC power. In order to maximize the power of electricity energy harvester, the simulation software is developed. It is used to determine parametric dimension for optimal design with the theoretically calculated results from the simulation software. The transient responses at the conditions of low and high vehicle speed are compared with the calculated results as torque, impact force, power, out energy etc. Consequently, before design a road generation system, the analysis of simulation results shows that the proposed concept and system has efficiency and confidence.
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A Verification Algorithm for Temperature Uniformity of the Large-area Susceptor
Hac Jin Yang, Seong Kun Kim, Jung Kun Cho
J. Korean Soc. Precis. Eng. 2014;31(10):947-954.
Published online October 1, 2014
Performance of next generation susceptor is affected by temperature uniformity in order to produce reliably large-sized flat panel display. In this paper, we propose a learning estimation model of susceptor to predict and appropriately assess the temperature uniformity. Artificial Neural Networks (ANNs) and Support Vector Machines (SVMs) are compared for the suitability of the learning estimation model. It is proved that SVMs provides more suitable verification of uniformity modeling than ANNs during each stage of temperature variations. Practical procedure for uniformity estimation of susceptor temperature was developed using the SVMs prediction algorithm.
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Geometrically Inhomogeneous Random Configuration Effects of Pt/C Catalysts on Catalyst Utilization in PEM Fuel Cells
Seungho Shin, Ah-Reum Kim, Hye-Mi Jung, Sukkee Um
J. Korean Soc. Precis. Eng. 2014;31(10):955-965.
Published online October 1, 2014
Transport phenomena of reactant and product are directly linked to intrinsic inhomogeneous random configurations of catalyst layer (CL) that consist of ionomer, carbon-supported catalyst (Pt/C), and pores. Hence, electrochemically active surface area (ECSA) of Pt/C is dominated by geometrical morphology of mass transport path. Undoubtedly these ECSAs are key factor of total fuel cell efficiency. In this study, non-deterministic micro-scale CLs were randomly generated by Monte Carlo method and implemented with the percolation process. To ensure valid inference about Pt/C catalyst utilization, 600 samples were chosen as the number of necessary samples with 95% confidence level. Statistic results of 600 samples generated under particular condition (20vol% Pt/C, 30vol% ionomer, 50vol% pore, and 20nm particle diameter) reveal only 18.2%~81.0% of Pt/C can construct ECSAs with mean value of 53.8%. This study indicates that the catalyst utilization in fuel cell CLs cannot be identical notwithstanding the same design condition.
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한국정밀공학회지 Vol.31 No.10 목차
J. Korean Soc. Precis. Eng. 2014;31(10):966-967.
Published online October 1, 2014
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