DRIE Technology for TSV Fabrication

Kyu-Ha Baek; Dong-Pyo Kim; Kun-Sik Park; Jin-Young Kang; Kijun Lee; Lee-Mee Do

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DRIE Technology for TSV Fabrication

Kyu-Ha Baek, Dong-Pyo Kim, Kun-Sik Park, Jin-Young Kang, Kijun Lee, Lee-Mee Do

JKSPE 2009;26(12):32-40.

Published online: December 1, 2009

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Keywords: Deep RIE (심도 반응성 이온 식각),Through Silicon Via (관통형 실리콘 비아),Bosch Process (보쉬공정),Cryogenic Process (극저온 공정)

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DRIE Technology for TSV Fabrication

J. Korean Soc. Precis. Eng.. 2009;26(12):32-40. Published online December 1, 2009

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DRIE Technology for TSV Fabrication

J. Korean Soc. Precis. Eng.. 2009;26(12):32-40. Published online December 1, 2009

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