CFRP (Carbon fiber reinforced plastic) has been widely used in different industries such as aerospace, automobile, sports and medical. Laser processing of CFRP has a great potential for industrial applications. In this paper researched the micro cutting and drilling of CFRP with 0.5 mm thickness using 1064 nm ytterbium nanosecond pulsed fiber laser. It also investigated machining characteristics of micro cutting and drilling according to laser power, frequency, scan speed and number of scan (or irradiation). Complete cutting and through-hole drilling were achieved with low frequency when the laser power was low and with low and middle frequency when the laser power increased. However, those were not achieved a frequency of 100 kHz. The cutting width increased when the power increased and decreased when the frequency and the scan speed increased. The hole size increased when the power and the number of irradiation increased and decreased when the frequency increased. In the case of micro hole array, the hole was blocked during the next hole machining when the hole spacing was narrow. The resin was melted by the heat thus blocking the pre-drilled hole. We devised the laser scan method, and the micro hole array with narrow hole spacing was fabricated successfully.
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This research aims to provide a useful algorithm for the prediction of the geometrical expansion of flat rings in the radialaxial ring rolling process in case of multiple variations of the mandrel feeding speed during the process. The proposed algorithm was subjected to a 2-phases validation process, where results were compared with those of laboratory experiments, conducted at 150℃ on rings made of AA-1070 and AA-6061 aluminum alloys, and with numerical simulations, considering 7 different rings with outer diameter ranging from 800 to 2000 ㎜ and made of 42CrMo4 steel alloy, Ti6Al4V titanium alloy and AA-6061 aluminum alloys. In the first and second validation phases, the maximum deviation in the estimation of the outer diameter of the ring has been calculated in 1.7% and 6.82%, respectively. According to the results of the validation, the proposed algorithm is able to properly predict the geometrical expansion of the ring for multiple variations of the mandrel feeding speed during the process and has good accordance with both relatively small and large rings.
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Various chemicals are used for semiconductor process. In particular, the most important element in the etching and cleaning process is chemical liquid. An ultrasonic flow meter is used to monitor the supplying amount of chemical solution. If the ultrasonic flow meter contains bubble inside the liquid, measurement cannot be performed or measurement error will be occurred. In this research, the waveform was improved by zero-crossing processing so that the influence on measurement performance is negligible even if the bubble in the chemical solution is included. Consequently, the amplitude of the sound wave is attenuated. Existing flow meters monitor the amplitude value to determine the authenticity of the signal and to filter the noise. The improved method in this study distinguishes noise waves and monitors signal frequency. Flow measurement was carrying out even when the amplitude was resulting only less than 3% of input level volt. The system developed of this study has shown an exact measuring performance compared with the other make’s flow meters.
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