Dry adhesives inspired by gecko footpads have garnered considerable attention due to their unique features, including strong yet reversible adhesion, self-cleaning properties, and repeatable use. However, scaling these microstructured adhesives from laboratory fabrication to continuous, high-throughput manufacturing poses significant challenges. In this study, we introduce a stepwise thermal patterning system designed for the scalable production of gecko-inspired dry adhesives on flexible substrates. This automated system combines sequential processes such as plate-to-plate micro-molding, rapid thermal curing, demolding, and roll-up of the patterned film. By raising the curing temperature to approximately 180^oC and employing an efficient stepwise imprinting method, we achieve fabrication speeds of up to 150 mm/min without compromising pattern accuracy. The system successfully replicates micropillar structures with a diameter of 15 μm and height of 15 μm, featuring 20 μm mushroom-shaped tips on flexible substrates. The resulting dry adhesives demonstrate stable pull-off strengths of 20-23 N/cm² and retain over 83.5% of their initial adhesion after 100,000 attachment–detachment cycles. These findings highlight the potential of our platform for reliable, high-throughput manufacturing of bio-inspired adhesives, paving the way for various industrial applications such as robotic manipulators, pick-and-place electronic assembly, and wearable devices that require repeated, residue-free attachment.

Intrinsically stretchable electronics enable seamless integration with dynamic biological tissues and curved surfaces, making them vital for next-generation wearables, biointerfaces, and intelligent robotics. Yet, precise, high-resolution patterning of stretchable electrodes and circuits remains challenging, limiting practical applications. Traditional lithography offers excellent resolution but is hindered by thermal and chemical incompatibilities with soft substrates. Consequently, alternative approaches such as soft lithography, laser-based patterning, printing methods, and electrospray deposition have gained importance. Soft lithography provides an economical, low-temperature option suitable for delicate materials like liquid metals. Laser-based techniques deliver high resolution and design flexibility but require careful parameter tuning for specific substrates. Mask-free printing methods, including direct ink writing and inkjet printing, enable versatile patterning of complex geometries, while electrospray deposition supports precise, non-contact patterning on stretchable surfaces. Collectively, these techniques advance the fabrication of robust stretchable displays, wireless antennas, and bioelectronic interfaces for accurate physiological monitoring. Despite progress, challenges persist, particularly in achieving large-area uniformity, multilayer stability, and sustainable processing. Addressing these issues demands interdisciplinary collaboration across materials science, fluid dynamics, interfacial engineering, and digital manufacturing. This review highlights recent progress and remaining hurdles, offering guidance for future research in stretchable electronics.